LHRFDGM3393 doc. no : qw0905- rev. : date : 20 - jul. a - 2007 data sheet LHRFDGM3393 dual color led lamps ligitek electronics co.,ltd. property of ligitek only pb lead-free parts
123 1.anode green 2.common cathode 3.anode red dgm hrf 0 30 60 50%75% 25% 0 25% 100% -30 -60 75% 100% 50% directivity radiation 7.6 8.6 10.5 0.5 5.0 5.9 1.5max 2.0min 2.54typ 2.54typ 0.5 typ 2.0min 1 2 3 18.0min part no. LHRFDGM3393 package dimensions page 1/6 ligitek electronics co.,ltd. property of ligitek only note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice.
mw LHRFDGM3393 power dissipation electrostatic discharge operating temperature storage temperature typical electrical & optical characteristics (ta=25 ) note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. reverse current @5v part no ingan/gan green 36 525 ---4.0 1500270040 viewing angle 2 1/2 (deg) dominant wave length dnm emitted algainp red material water clear lens color forward voltage @ ma(v) 20 630 min. 1.5 spectral halfwidth nm 20 max. 2.4 min. 700 typ. 110040 luminous intensity @20ma(mcd) 2000 tstg esd t opr pd ir -30 ~ +100 150 50 120 -20 ~ +80 10 75 v a forward current peak forward current duty 1/10@10khz absolute maximum ratings at ta=25 page ligitek electronics co.,ltd. property of ligitek only hrf parameter i f i fp symbol ratings 100 30 dgm 30 90 ma ma unit 2/6 peak wave length pnm ---- 518 typ. --- 3.5 part no. LHRFDGM3393
0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 20 ambient temperature( ) ambient temperature( ) 0.8 -0 -20 -4060 40 2080100 0 -40-20-060 4080100 fig.4 relative intensity vs. temperature 2.5 1.0 0.9 1.1 1.5 1.0 2.0 fig.3 forward voltage vs. temperature 1.2 3.0 100 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a f o r w a r d c u r r e n t ( m a ) forward current(ma) forward voltage(v) 1.5 1.0 0.1 2.5 2.03.01.010 0 1.0 10 0.5 1.0 1.5 2.0 1001000 fig.2 relative intensity vs. forward current fig.1 forward current vs. forward voltage 1000 3.5 2.5 typical electro-optical characteristics curve ligitek electronics co.,ltd. property of ligitek only 3.0 hrf chip page 3/6 part no. LHRFDGM3393 r e l a t i v e i n t e n s i t y @ 2 0 m a 550 0 0.5 650700 600 wavelength (nm) fig.5 relative intensity vs. wavelength 1.0
3.0 2.5 1.5 1.0 0.5 0.0 2.0 fig.4 relative intensity vs. temperature r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) 450 0.0 0.5 500550600 ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 1.0 -40 0.8 -20 1.1 1.0 0.9 1.2 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 20 060 40100 80 ambient temperature( ) -40-20 02060 40100 80 3.0 2.5 2.0 1.5 1.0 0.5 0.0 ligitek electronics co.,ltd. property of ligitek only fig.2 relative intensity vs. forward current typical electro-optical characteristics curve 2.0 fig.1 forward current vs. forward voltage forward voltage(v) 100 f o r w a r d c u r r e n t ( m a ) 1.0 0.1 1.0 10 dgm chip 1000 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 3.04.05.0 page4/6 1000 forward current(ma) 1.010100 part no. LHRFDGM3393
dip soldering preheat: 120 c max preheat time: 120seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 100 0 0 preheat 25 120 2 /sec max 250 200 time(sec) 260 temp( c) 5 /sec max 260 c3sec max page 5/6 soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) 2.wave soldering profile ligitek electronics co.,ltd. property of ligitek only 120 seconds max part no. LHRFDGM3393
1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=230 5 2.dwell time=5 1sec solderability test solder resistance test thermal shock test high temperature high humidity test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. this test intended to see soldering well performed or not. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 the purpose of this test is the resistance of the device under tropical for hours. mil-std-202:103b jis c 7021: b-11 test condition 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) low temperature storage test high temperature storage test operating life test test item reliability test: mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. jis c 7021: b-12 the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. mil-std-883:1008 jis c 7021: b-10 description reference standard ligitek electronics co.,ltd. property of ligitek only page 6/6 part no. LHRFDGM3393
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